Product Description

Layers(2-38) Lines and Spaces(Volume 3/3 Prototype 2.5/2.5) Controlled Impedance(+/- 10% Standard) Blind and Buried Vias Microvias,Laser Drill Backpanels (up to 1 inch thick) MCM/Substrates High Performance and Emerging Materials Sequential Lamination Micro BGA,BGA Plug Finishing: Entek(OSP),HAL,HAL Lead Free, Immersion Glod, Flash Gold, Immersion Sliver, Immersion Tin Special PCBs Heavy Copper PCBs