Product Description

CNM could provide high quality target material for the field of electrical and semiconductor devices, flat panel display, architectural and automotive glass, thin film solar cell, magnetic storage, instrument, decorate thin film, etc. High pure metal sputtering target: Al, Cr, Cu, Ni, Si, Ge, Nb, Ti, In, Ag, Sn, graphite, Ta, Mo, Au, Hf, Mn, Zr, Mg, Zn, Pb, Ir, Y, Ce, La, Yb, Gd, pt Target High density ceramic sputtering target: ITO target, AZO target,IGZO target, MgO, Y2O3, Fe2O3, Ni2O3, Cr2O3, ZnO, ZnS, CdS, MoS2, SiO2, SiO, ZrO2, Nb2O5, TiO2, HfO2, TiB2, ZrB2, WO3, Al2O3, Ta2O5, MgF2, ZnSe, AlN, Si3N4, BN,TiN, SiC, LiNbO3, BaTiO3, LaTiO3, PrTiO3 target, etc. Note: The ceramic target produced in CNM adopts the most advanced ceramic production technology-inert gas protection hot isostatic pressing sintering technology, the relative density is grater than 95-99%. In addition, CNM could provide with the metalizing process of the target and unbounded services. High pure alloy sputtering target: Ni-V Alloy target, Ni-Cr target, Ti-Al Alloy target, Si-Al Alloy target, Cu-Im Alloy target, Cu-Ga Alloy target, Cu-Im-Ga Alloy target, Cu-Im-Ga-Se Alloy target, stainless steel target, Zn-Al Alloy target,W-Ti Alloy target, Fe-Cot Alloy target, etc Note: CNM product high purity Alloy sputtering target: tiny grain size number (150-60um), high relative density (99-99.9%), high purity (99.9-99.999%). In addition, CNM provides with the metalizing process of the target materials and unbounded services.