Product Description
SPS Bis-(sodium sulfopropyl)-disulfide
Intermediate for copper electroplating
1) CAS NO. 27206-35-5
2) Molecular formula: C6H12O6S4Na2
3) Molecular weight: 354.4
4) EINECS NO. 248-324-3
5) Applications: brightener in copper baths for decorative and functional deposits
6) Appearance: White or yellowish powder
7) Concentration in the bath:10-100mg/L
8) PH Value: 3-7(38%water solution)
9) Storage condition: Stored in cool and dry place
10) Valid period(year): 2
Company Profile
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Business Type: |
Electroplating additive, nickel plating, Electroplating chemicals,
electro plating |
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Comapany: |
Hubei lingzhi chemicals technology industry co., ltd |
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Address: |
12 Floor, Incubation Building, Wuhan Institute of Technology, Wuhan, China |
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City: |
Wuhan |
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Zip/Postal: |
430074 |
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State: |
Hubei |
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Country: |
China |
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