Product Description

1. Wafer Diameter: (125 x 125)+/-0,4mm 2. Dimensions Tolerance: +/-0,4mm 3. Thickness of wafer, measured in the center of wafer: 190+/- 10µm, =185 µm 4. TTV: not more than 25 µm 5. Saw mark: =15 µm, invisible by eyes 6. Camber: =30 µm 7. Arc width departure(Big and small angle): =2mm in 45° 8. Surface Quality: No crack, no obvious saw mark, without obvious tactility, no pit, no V type gap, no hole, no glue left, surface cleaned, no abnormal spot, no stain. 9. Notch: not allowed